Toshiba Memory Corporation has announced development of the world’s first BiCS (Bit Cost Scaling) FLASH - a three-dimensional (3D) flash memory utilising Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology.
Just when you didn’t think memory could get any denser (there has to be a joke in that somewhere), Toshiba ups the ante and is shipping samples of the world’s first 64-layer, three-dimensional, stacked Flash memory.
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